What is the current situation of atmospheric plasma cleaning machines in the field of new energy?

Atmospheric plasma cleaning machine can treat the surface of the sample by generating active groups without gas ionization, thereby achieving the purpose of cleaning. In addition to its cleaning function, it can also activate and etch, and is widely used in various fields. Plasma cleaning equipment, as a type of dry cleaning, requires the vacuum pump to create certain vacuum conditions to meet the cleaning needs. The cleaning of atmospheric plasma cleaning machine needs to be carried out in a vacuum state (generally maintained at around 100Pa), so a vacuum pump is required for vacuuming operation.

The main process of a plasma cleaning machine includes: first, sending the workpiece to be cleaned into a vacuum chamber and fixing it, starting the vacuum pump and other devices, starting to evacuate and exhaust to a vacuum degree of about 10Pa; then introducing the plasma cleaning gas into the vacuum chamber (selecting different gases such as O2, H2, Ar, N2, etc. according to different cleaning materials, and maintaining the pressure at around 100Pa; 

applying high-frequency voltage between the vacuum chamber electrode and the grounding device, causing the gas to be broken down by glow discharge, producing ionization and plasma; the plasma generated in the vacuum chamber completely covers and cleans the workpiece. After the workpiece is completed, the cleaning work begins, and the cleaning process will last for tens of seconds to several minutes.

Plasma cleaning technology is increasingly in line with the development requirements of the semiconductor industry，Plasma cleaner, also known as plasma processing machine, is a high-tech technology that uses plasma to achieve effects that conventional cleaning methods cannot achieve. In the field of wafer packaging, the application of plasma cleaning equipment is crucial, mainly reflected in the following aspects:

1. Plasma cleaning equipment can quickly remove residual impurities on the surface of electronic components such as wafers and chips, such as photoresist, flux, oxides, and pollutants on the surface of aluminum materials. After plasma cleaning treatment, it can enhance the clean surface, reduce delamination between products, ensure the accuracy and stability of subsequent processes, and improve the yield and bonding strength of subsequent metal bonding processes.

2. Low temperature plasma cleaning technology can change the flowability of epoxy resin adhesive surface and increase the adhesion between integrated circuits and packaging substrates. Meanwhile, through low-temperature plasma cleaning, the surface activity of the chip can be significantly improved, cracks can be reduced, welding reliability can be enhanced, and the mechanical strength of the packaging can be strengthened.

3. After plasma cleaning, the wetting performance of the material surface can be significantly improved, the contact angle of water droplets decreases, the surface tension decreases, and it is conducive to forming a good bonding interface. In addition, plasma cleaning equipment can also change the functional group state on the surface of materials, increase surface free energy, form highly polar chemical groups, and thus enhance the adhesion of bonding interfaces.

4. Wire bonding is one of the key process steps in microelectronic packaging. Plasma cleaning technology uses high-frequency electric fields to excite gas molecules into plasma, bombard the surface of the cleaned product, remove stains, and improve surface performance. This can not only optimize the wire bonding process, improve bonding strength, but also reduce bonding failures and improve packaging quality. According to statistics,

Compared with traditional wet cleaning, plasma cleaning technology, as a dry cleaning method, can avoid the use of chemical cleaning agents and reduce the generation of harmful waste liquids, which is in line with the development trend of green production. This is not only beneficial for environmental protection, but also can reduce the environmental pressure on enterprises.

In summary, plasma cleaning machines have significant advantages and effects in the field of chip packaging. Plasma cleaning equipment can effectively remove pollutants, enhance surface activity, improve material surface properties, optimize wire bonding processes, and achieve environmentally friendly and pollution-free production methods. I believe that plasma cleaning machines will have broad application prospects and important application value in the field of chip packaging in the future.