What is the effect of plasma activation etching treatment before chip lead frame? Plasma cleaning machine can improve adhesion and corrosion resistance!

In recent years, plasma surface treatment machines have emerged in the optimization process of chip lead frames. Their unique cleaning, activation, modification, etching and other properties provide new possibilities for improving the performance of lead frames. Whether plasma cleaning machines can quickly remove residues on the chip surface, and whether ion cleaning machines can quickly eliminate particle pollutants, today we will deeply analyze and learn some significant characteristics of plasma surface treatment machines in the field of new energy.

Firstly, in the semiconductor manufacturing process, there may be residual organic substances such as photoresist, release agents, and grease on the surface of wafers or chips. Optimizing every detail may affect the overall performance and performance of the product. Active oxygen ions (such as O ⁻, O ₂ ⁻) in the plasma can be decomposed into volatile substances such as CO ₂ and H ₂ O through oxidation reactions, completely removing surface oxides. The chip lead frame is an important component of the internal connectors of the chip, and its quality directly affects the speed and reliability of electrical signal transmission.

Secondly, the ion bombardment effect of argon plasma can physically strip surface metal impurities, while hydrogen plasma can reduce metal oxides, avoiding the influence of oxide layers on welding or bonding quality.

Finally, through ion bombardment and airflow erosion, micro - or nano sized particles can be effectively removed. During the manufacturing process, the lead frame needs to be in contact with various metals, which requires the material to have excellent adhesion. Plasma cleaning equipment technology can significantly improve the adhesion and corrosion resistance of raw materials by activating the oxide layer on the surface, thereby better meeting this demand. Many consumers may ask how to choose plasma cleaning machines on the market,

 such as atmospheric pressure, vacuum, wide width, and online plasma cleaning machines. Generally speaking, in the field of chip packaging, vacuum plasma cleaning machines are the most commonly purchased because they can not only improve the hardness and wear resistance of materials, but also form a conductive film on the surface of materials by controlling the temperature and gas composition in the plasma, thereby increasing their conductivity. It is said that this method has been successfully applied in the manufacturing of semiconductor wafers, which can greatly improve the operating efficiency and energy consumption ratio of chips. 

Nano level argon plasma cleaning machines can further enhance the micro roughness of the surface after cleaning and remove residual corrosive substances on the surface. The sentence is:, To avoid electrochemical corrosion caused by moisture intrusion after packaging, improve packaging quality, and extend the long-term reliability of the product.

The vacuum plasma cleaning machine can quickly remove various organic substances such as grease, photoresist, release agents, etc., as well as inorganic substances such as metal oxides, metal impurities, and small particle pollutants, achieving ultra clean surface effects. For example, in semiconductor manufacturing, it can remove residues at the 0.1 nanometer level.

In summary, vacuum plasma cleaning technology can greatly reduce the production cost of lead frames by precisely controlling the processing process. 

With the advancement of technology and the promotion of applications, we have reason to believe that plasma cleaning technology will play a more important role in future semiconductor manufacturing.